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Sokymat Glass TagHID Global QualitySokymat Tags, brand bellowing HID Global group, are characterized by a high quality manufacture. This quality is assured by joining two very important points to bear in mind in the manufacturing process: Technology of difference and Additional own Tests on its products. The technology difference : is based on the exclusive development of Direct Bonding Technology. By this technology, developed and patented by HID Global, little and solid encapsulated can be obtained, and have more physical resistance for the tag handling. Tests
- Dynamic bending stress: consists in bending the length and the width of the card many times. - Dynamic torsional stress: consists in applying torsion to the card.
- Flipper test: consists in clamping to a harsh ground the width side of a card. The end of the card containing the IC is lifted with the finger up to 60°. This test is performed 20 times on both sides of the card.
- Bending test: consists in bending the length side of the card on a cylinder (ø 30mm) with the maximum stress on the IC. This test is performed 10 times on each side. These tests have the purpose to check resistance, hardness and operating of the handled cards. Don’t you know all the offer of Kimaldi’s RFID range? |
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